BGF124 sim card interface filter and usb interface with esd protection data sheet, v2.0, april 2009 small signal discretes
edition 2009-04-01 published by infineon technologies ag 81726 mnchen, germany ? infineon technologies ag 2009. all rights reserved. legal disclaimer the information given in this docu ment shall in no event be regarded as a guarantee of conditions or characteristics (?beschaffenheitsgarantie?). with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the app lication of the device, infi neon technologies hereby disclaims any and all warranties a nd liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. information for further information on technology , delivery terms and conditions and prices please contact your nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements components may contain da ngerous substances. for information on the types in question please contact your nearest infineon technologies office. infineon technologies components may only be used in life-support devices or systems with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safe ty or effectiveness of that device or system. life support devices or systems are intended to be implanted in the hu man body, or to support an d/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
BGF124 sim card interface filter and usb interface with esd protection data sheet 3 v2.0, 2009-04-01 BGF124 revision history: 2009-04-01, v2.0 previous version: 2008-05-27, v1.0 page subjects (major cha nges since last revision) all target status removed 5, 6 figure 2 and figure 3 updated 7 figure 5 added
data sheet 4 v2.0, 2009-04-01 BGF124 sim card interface filter and usb interface with esd protection BGF124 BGF124 description BGF124 is an esd protection and filterin g circuit for sim card and usb interfaces. all external ios are protected against esd pulses of 15 kv contact discharge accordin g to iec61000-4-2. the wafer level package is a green lead-free and halogen-free package with a size of only 1.15 mm x 1.55 mm and a total height of 0.6 mm figure 1 schematic features ? esd protection circuit and interface filter for sim cards ? reduced line capacitance of 12 pf maximum ? esd protection according to iec61000-4-2 for 15 kv contact discharge on external ios ? wafer level package with snagcu solder balls ?400 m solder ball pitch ? rohs and weee co mpliant package type package marking chip BGF124 wlp-11-4 24 n0744 table 1 maximum ratings parameter symbol values unit note / test condition min. typ. max. voltage at all pins to gnd v p 0?5v? operating temperature range t op -40 ? +85 c? storage temperature range t stg -65 ? +150 c? summed up input power for all pins p in ??60mw t s <70c electrostatic discharge according to iec61000-4-2 contact discharge at internal pins a1, b1, c1 v esd -2 ? 2 kv ? contact discharge at exte rnal pins a3, b3, c3, d1, d2, d3 v esd -15 ? 15 kv ? wlp-11-4-n BGF124 _schematic.vsd gnd, a2 , c2 c3 b3 a3 c1 b1 a1 r1, 100 ? r2, 47 ? r3, 100 ? d1 ext . ios d2 d3
BGF124 sim card interface filter and usb interface with esd protection BGF124 data sheet 5 v2.0, 2009-04-01 figure 2 insertion loss table 2 electrical characteristics 1) 1) at t a =25 c parameter symbol values unit note / test condition min. typ. max. resistors r 1 , r 3 r 1,3 80 100 120 ? ? resistor r 2 r 2 37.6 47 56.4 ? ? leakage current of esd protection diodes i l ? ? 1 2 100 200 na na v =3v v =5v breakdown voltage of esd diodes 2) 2) after snap-back v (br) ?18.5 -12.5 ?v i (br) = 1ma i (br) =-1ma line capacitance capacitance of all lines to gnd c t 8 1012pf v =0v BGF124 insertion loss -60 -50 -40 -30 -20 -10 0 1 10 100 1000 10000 mhz db a1- a3 b1-b3
data sheet 6 v2.0, 2009-04-01 BGF124 sim card interface filter and usb interface with esd protection BGF124 figure 3 typical cross talk package outlines figure 4 wlp-11-4 (wafer level package) BGF124 cross talk -100 -80 -60 -40 -20 0 1 10 100 1000 10000 mhz db c1-b3 d1-c1 d1-d2 corner index area pin 1 2) coplanarity 0.6 seating plane 0.08 11x c c standoff 3) 0.05 0.2 (0.175 0.05 ) 0.05 ) 0.05 ) 0.05 ) (0.175 0.05 0.1 c 0.4 0.05 1.15 b 3 x 0.4 = 1.2 0.4 1.55 0.05 a a 11x ?0.05 m 0.25 b 0.04 1) 3) primary datum c and seating plane are defined by the domed crowns of the balls 1) dimension is measured at the maximum solder ball diameter, parallel to primary datum c 2) identified by marking wlp-11-4-n-po v01 2 x 0.4 = 0.8 d3 d2 d1 c2 a2 c3 b3 c1 b1 a3 a1 (0.175 (0.175 solder balls face down solder balls face up
BGF124 sim card interface filter and usb interface with esd protection BGF124 data sheet 7 v2.0, 2009-04-01 footprint figure 5 recommended pcb pad design for reflow soldering tape figure 6 tape for BGF124 / wlp-11-4 you can find all of our packages, sorts of packing and others in our infineon internet page ?products?: http://www.infineon.com/products . wlp-11-4-n-fp v01 0.4 0.8 0.4 1.2 0.25 wlp-11-4-n-tp v01 pin 1 corner index area 8 1.78 1.32 0.25 0.75 4
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